Análisis Argos
Q
QCara
Qnity Electronics, Inc. · Technology
US$ 141.75
precio al 2026-07-04
Valor justo Argos*
US$ 67–73
vs. su valor justo
94% por encima
Score Argos
41/100
LA RESPUESTA
El mercado le pide crezca 31.5% al año — más de lo que ha demostrado (7.2%). Estás pagando un futuro que todavía no probó: el margen de error es mínimo.
Recompensas
Sin recompensas destacadas.
Riesgos
!El precio pide más crecimiento del que la empresa ha demostrado.
VALOR1/6FUTURO3/6PASADO2/6SALUD3/6DIVIDENDO1/6
El Iris de calidad
VALOR1/6FUTURO3/6PASADO2/6SALUD3/6DIVIDENDO1/6
ValorCotiza por encima de su valor justo
FuturoCrecimiento moderado
PasadoHistorial aceptable
SaludBalance razonable
DividendoEl dividendo aún duerme
Score Argos41de 100Cara
Ingresos10%
US$ 4.8 B
Margen operativo9%
21.3%
Flujo de caja libre15%
US$ 1 B
Deuda neta
US$ 4.1 B
Lo esencial, sin ruido
Cap. de mercadoUS$ 29.7B
P/E42.9x
EV/EBITDA24.3x
FCF yield3.3%
ROIC6.9%
Margen operativo21.3%
Crecim. ingresos+9.7%/año
Piotroski F4/9
Competidores

Los rivales, con el mismo ojo

El Iris de calidad de cada competidor, lado a lado. Tocá uno para ver su análisis.

Novedades

Noticias recientes

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businesswire.com · 24 jun
Qnity Announces Third Quarter 2026 Dividend on Common Stock
WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, announced that its Board of Directors has declared a quarterly dividend of 0.08 cents ($0.08) per share for each share of issued and outstanding common stock of the Company (par value $0.01 per share). The dividend will be payable on September 15, 2026 to stockholders of record on August 31, 2026. Learn about how Qnity is powering the next l.
businesswire.com · 22 jun
Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions
WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company. The new online platform showcases Qnity's breadth of material and technology solutions designed for advanced packaging, enabling the next generation of artificial intellige.
seekingalpha.com · 16 jun
Qnity Electronics, Inc. (Q) Presents at 3rd Annual Materials of the Future Conference Transcript
Qnity Electronics, Inc. (Q) Presents at 3rd Annual Materials of the Future Conference Transcript
businesswire.com · 12 jun
Qnity to Present at the Wolfe Research Materials of the Future Conference
WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qnity's Chief Executive Officer, will participate in a fireside chat at the Wolfe Research 3rd Annual Materials of the Future Conference on June 16, 2026, at 8:35 a.m. ET. A live webcast of the fireside chat will be available at Events | Qnity Electronics, Inc. (Q). A replay of the webcast will be available fol.
gurufocus.com · 12 jun
Qnity to Present at the Wolfe Research Materials of the Future Conference
Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that Jon Kemp, Qni
businesswire.com · 10 jun
Qnity Launches Optivision™ Max CMP Pad Family to Enable Next-Generation Semiconductor Manufacturing
WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the expansion of its offerings for chemical mechanical planarization (CMP) with the introduction of Optivision™ Max polishing pads. As semiconductor devices continue to shrink and increase in complexity, diverse CMP processes are critical to achieving the precision required for reliable device performance. Optivision™ Max CMP.
businesswire.com · 8 jun
Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications
WILMINGTON, Del.--(BUSINESS WIRE)--Qnity Electronics, Inc. (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today introduced enhanced advanced packaging material solutions for organic interposer applications: Intervia™ 8540HSP multi-role copper and Cyclotene™ DF6800M dry film photo-imageable dielectric. The material innovations are designed to support advanced interconnect formation, redistribution layer (RDL) designs, and emerging glass-based substrate str.

* Valor justo Argos: estimación educativa del valor intrínseco según el propio flujo de caja de la empresa y su capacidad de crecimiento — no un precio objetivo ni una recomendación. Esto es información y educación, no asesoría de inversión. Rendimiento pasado no garantiza resultados futuros.